7014S12PF
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IDT, Integrated Device Technology Inc 7014S12PF

Part Number:
7014S12PF
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
3724237-7014S12PF
Description:
IC SRAM 36KBIT 12NS 64TQFP
ECAD Model:
Datasheet:
IDT Suffixes
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Unit Price

Ext Price

  • 1

    $63.6149

    $63.61

  • 180

    $25.3828

    $4568.90

  • 495

    $24.5353

    $12144.97

  • 990

    $24.1161

    $23874.94

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Comments
Part Overview
Description
High-speed 4Kx9 Dual-Port Static RAM
True dual-ported memory cells for simultaneous reads
Asynchronous operation from either port
TTL-compatible; single 5V power supply
Available in 52-pin PLCC and 64-pin TQFP

Features
High-speed access: 12ns (max.)
Standard-power operation: 750mW (typ.)
9-bit wide data path for optional parity
Fully asynchronous operation
TTL-compatible; single 5V power supply

Applications
Systems without on-chip hardware port arbitration
High-speed applications that do not rely on BUSY signals
Data communication applications requiring parity for error checking
Specifications
IDT, Integrated Device Technology Inc 7014S12PF technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 7014S12PF.
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    64-LQFP
  • Supplier Device Package
    64-TQFP (14x14)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C TA
  • Packaging
    Tray
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    SRAM - Dual Port, Asynchronous
  • Voltage - Supply
    4.5V~5.5V
  • Base Part Number
    IDT7014
  • Memory Size
    36Kb 4K x 9
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Volatile
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    12ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    SRAM
  • Memory Interface
    Parallel
  • Write Cycle Time - Word, Page
    12ns
  • RoHS Status
    Non-RoHS Compliant
Product Comparison
The three parts on the right have similar specifications to 7014S12PF.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Voltage - Supply
    Base Part Number
    Memory Size
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    RoHS Status
    Factory Lead Time
    View Compare
  • 7014S12PF
    7014S12PF
    Surface Mount
    64-LQFP
    64-TQFP (14x14)
    0°C~70°C TA
    Tray
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    4.5V~5.5V
    IDT7014
    36Kb 4K x 9
    Volatile
    12ns
    SRAM
    Parallel
    12ns
    Non-RoHS Compliant
    -
    -
  • 7014S15PF8
    Surface Mount
    64-LQFP
    64-TQFP (14x14)
    0°C~70°C TA
    Tape & Reel (TR)
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    4.5V~5.5V
    IDT7014
    36Kb 4K x 9
    Volatile
    15ns
    SRAM
    Parallel
    15ns
    Non-RoHS Compliant
    -
  • 7014S25J
    Surface Mount
    52-LCC (J-Lead)
    -
    0°C~70°C TA
    Tube
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    4.5V~5.5V
    IDT7014
    36Kb 4K x 9
    Volatile
    -
    SRAM
    Parallel
    25ns
    Non-RoHS Compliant
    -
  • 7014S12JG
    Surface Mount
    52-LCC (J-Lead)
    52-PLCC (19.13x19.13)
    0°C~70°C TA
    Tube
    Active
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    4.5V~5.5V
    IDT7014
    36Kb 4K x 9
    Volatile
    12ns
    SRAM
    Parallel
    12ns
    ROHS3 Compliant
    12 Weeks
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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