Laird Technologies EMI 67SLG030030050PI00
- Part Number:
- 67SLG030030050PI00
- Manufacturer:
- Laird Technologies EMI
- Ventron No:
- 4404486-67SLG030030050PI00
- Description:
- METAL FILM OVER FOAM CONTACTS
- ECAD Model:
-
- Datasheet:
- Soft SMD Grounding Contacts
Laird Technologies EMI 67SLG030030050PI00 technical specifications, attributes, parameters and parts with similar specifications to Laird Technologies EMI 67SLG030030050PI00.
- Factory Lead Time4 Weeks
- MaterialPolyurethane Foam, Tin-Copper Polyester (SN/CU)
- ShapeRectangle
- Operating Temperature-40°C~70°C
- PackagingTape & Reel (TR)
- SeriesSMD Grounding Metallized
- Published2015
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Max Operating Temperature158°C
- Min Operating Temperature-40°C
- Attachment MethodSolder
- Height0.118 3.00mm
- Length0.197 5.00mm
- Width0.118 3.00mm
- Thickness3.048mm
- RoHS StatusRoHS Compliant
67SLG030030050PI00 Overview
The Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI operates normally at -40°C~70°C. The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.A contacter RFI temperature of 158°C degrees Celsius is recommended.Type Film Over Foam from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.
67SLG030030050PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG030030050PI00 Applications
There are a lot of Laird Technologies EMI
67SLG030030050PI00 RFI and EMI Contacts applications.
Switch
LoT applications
Power Amplifier
Low Noise Amplifier
Power management
Internet of Things
Secure Payment
Home and Security
Health and Fitness
Industrial Logger
The Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI operates normally at -40°C~70°C. The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.A contacter RFI temperature of 158°C degrees Celsius is recommended.Type Film Over Foam from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.
67SLG030030050PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG030030050PI00 Applications
There are a lot of Laird Technologies EMI
67SLG030030050PI00 RFI and EMI Contacts applications.
Switch
LoT applications
Power Amplifier
Low Noise Amplifier
Power management
Internet of Things
Secure Payment
Home and Security
Health and Fitness
Industrial Logger
67SLG030030050PI00 More Descriptions
METAL FILM OVER FOAM CONTACTS
SLG W3MM H3MM L5MM
SLG W3MM H3MM L5MM
The three parts on the right have similar specifications to 67SLG030030050PI00.
-
ImagePart NumberManufacturerFactory Lead TimeMaterialShapeOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureAttachment MethodHeightLengthWidthThicknessRoHS StatusView Compare
-
67SLG030030050PI004 WeeksPolyurethane Foam, Tin-Copper Polyester (SN/CU)Rectangle-40°C~70°CTape & Reel (TR)SMD Grounding Metallized2015Active1 (Unlimited)158°C-40°CSolder0.118 3.00mm0.197 5.00mm0.118 3.00mm3.048mmRoHS Compliant- -
4 WeeksPolyurethane Foam, Tin-Copper Polyester (SN/CU)Hourglass-40°C~70°CTape & Reel (TR)SMD Grounding Metallized2015Active1 (Unlimited)158°C-40°CSolder0.315 8.00mm0.276 7.00mm0.236 6.00mm8.001mmRoHS Compliant
-
3 WeeksPolyurethane Foam, Tin-Copper Polyester (SN/CU)Hourglass-40°C~70°CTape & Reel (TR)SMD Grounding Metallized2015Active1 (Unlimited)158°C-40°CSolder0.197 5.00mm0.197 5.00mm0.197 5.00mm5.0038mmRoHS Compliant
-
4 WeeksPolyurethane Foam, Tin-Copper Polyester (SN/CU)Rectangle-40°C~70°CTape & Reel (TR)SMD Grounding Metallized2015Active1 (Unlimited)158°C-40°CSolder0.315 8.00mm0.276 7.00mm0.236 6.00mm8.001mmRoHS Compliant
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