49FCT3805APYG
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IDT, Integrated Device Technology Inc 49FCT3805APYG

Part Number:
49FCT3805APYG
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
3820205-49FCT3805APYG
Description:
IC CLOCK BUFFER 1:5 20SSOP
ECAD Model:
Datasheet:
IDT Suffixes
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Qty

Unit Price

Ext Price

  • 1

    $0.8659

    $0.87

  • 10

    $0.8459

    $8.46

  • 30

    $0.8320

    $24.96

  • 100

    $0.8196

    $81.96

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Comments
Part Overview
Description
3.3V, non-inverting clock driver
Dual metal CMOS technology
Two independent output banks with 3-state control
1:5 fanout per bank
"Heartbeat" monitor output
Low capacitance inputs with hysteresis
Designed for high-speed clock distribution with low skew and high signal quality

Features
0.5-micron CMOS technology
Guaranteed low skew (<500ps)
Very low duty cycle distortion (<1.0ns)
Very low CMOS power levels
TTL-compatible inputs and outputs
Inputs can be driven from 3.3V or 5V components
Available in SSOP, SOIC, and QSOP packages

Applications
Clock distribution
Single point-to-point transmission line driving
Address distribution
Specifications
IDT, Integrated Device Technology Inc 49FCT3805APYG technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 49FCT3805APYG.
  • Factory Lead Time
    5 Weeks
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SSOP
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    20
  • Published
    2009
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1
  • Number of Terminations
    20
  • ECCN Code
    EAR99
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    2
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.635mm
  • Reflow Temperature-Max (s)
    30
  • Pin Count
    20
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    10
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    TTL
  • Operating Supply Voltage
    3.3V
  • Temperature Grade
    COMMERCIAL
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    2
  • Max Supply Voltage
    3.6V
  • Min Supply Voltage
    3V
  • Nominal Supply Current
    20mA
  • Propagation Delay
    5 ns
  • Quiescent Current

    Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.

    10μA
  • Turn On Delay Time
    5 ns
  • Family
    FCT
  • Logic Function
    Clock
  • Output Characteristics
    3-STATE
  • Input
    LVTTL
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    7.2mm
  • Width
    5.3mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    1.73mm
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Product Comparison
The three parts on the right have similar specifications to 49FCT3805APYG.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Number of Pins
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Max Operating Temperature
    Min Operating Temperature
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Pin Count
    Number of Outputs
    Output Type
    Operating Supply Voltage
    Temperature Grade
    Number of Circuits
    Max Supply Voltage
    Min Supply Voltage
    Nominal Supply Current
    Propagation Delay
    Quiescent Current
    Turn On Delay Time
    Family
    Logic Function
    Output Characteristics
    Input
    Length
    Width
    Thickness
    Radiation Hardening
    RoHS Status
    Lead Free
    Subcategory
    Logic IC Type
    Same Edge Skew-Max (tskwd)
    Qualification Status
    Mounting Type
    Operating Temperature
    Packaging
    Series
    Voltage - Supply
    Base Part Number
    Output
    Ratio - Input:Output
    Differential - Input:Output
    View Compare
  • 49FCT3805APYG
    49FCT3805APYG
    5 Weeks
    Tin
    Surface Mount
    SSOP
    20
    2009
    e3
    yes
    Active
    1
    20
    EAR99
    70°C
    0°C
    CMOS
    DUAL
    GULL WING
    260
    2
    3.3V
    0.635mm
    30
    20
    10
    TTL
    3.3V
    COMMERCIAL
    2
    3.6V
    3V
    20mA
    5 ns
    10μA
    5 ns
    FCT
    Clock
    3-STATE
    LVTTL
    7.2mm
    5.3mm
    1.73mm
    No
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 49FCT3805AQGI
    4 Weeks
    Tin
    Surface Mount
    QSOP
    20
    2001
    e3
    yes
    Active
    1
    20
    EAR99
    85°C
    -40°C
    CMOS
    DUAL
    GULL WING
    260
    2
    3.3V
    0.635mm
    -
    20
    10
    TTL
    3.3V
    INDUSTRIAL
    2
    3.6V
    3V
    20mA
    5.2 ns
    10μA
    5.2 ns
    FCT
    -
    3-STATE
    LVTTL
    8.7mm
    3.8mm
    1.47mm
    No
    RoHS Compliant
    Lead Free
    Clock Drivers
    LOW SKEW CLOCK DRIVER
    0.6 ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 49FCT3805QGI
    4 Weeks
    Tin
    Surface Mount
    QSOP
    20
    2009
    e3
    yes
    Active
    1
    20
    EAR99
    85°C
    -40°C
    CMOS
    DUAL
    GULL WING
    260
    2
    3.3V
    0.635mm
    NOT SPECIFIED
    20
    10
    -
    3.3V
    INDUSTRIAL
    2
    3.6V
    3V
    20mA
    5.8 ns
    10μA
    -
    FCT
    -
    3-STATE
    LVTTL
    8.7mm
    3.8mm
    1.47mm
    -
    RoHS Compliant
    Lead Free
    Clock Drivers
    LOW SKEW CLOCK DRIVER
    0.6 ns
    Not Qualified
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 49FCT805APYGI8
    -
    -
    -
    20-SSOP (0.209, 5.30mm Width)
    -
    -
    -
    -
    Last Time Buy
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    2
    -
    -
    -
    -
    -
    -
    -
    -
    -
    CMOS, LVTTL
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    Surface Mount
    -40°C~85°C
    Tape & Reel (TR)
    49FCT
    4.75V~5.25V
    IDT49FCT805
    CMOS, LVTTL
    1:5
    No/No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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