Preci-Dip 483-10-224-00-001101

Contact Material refers to the material used to make the electrical contacts in a component. It determines the electrical conductivity, durability, and resistance to corrosion and wear of the contacts. Common contact materials include copper, silver, gold, and alloys of these metals. The choice of contact material depends on the specific application and the required performance characteristics.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Number of Positions, in the context of electronic components, refers to the number of distinct terminals or connection points available on the component. It indicates the number of individual electrical connections that can be made to the component. A higher number of positions typically allows for more complex functionality and versatility in circuit design.

Contact Type refers to the physical construction and materials used in the electrical contacts of a component. It describes the type of connection made between two or more conductors.

Pitch, in the context of electronic components, refers to the distance between the centers of adjacent pins or terminals on a component. It is typically measured in millimeters (mm) or inches (in). The pitch determines the spacing between components on a printed circuit board (PCB) and affects the overall size and layout of the board. A smaller pitch allows for more components to be placed on a given area, but it also increases the risk of shorts and other manufacturing defects.

Insulation Resistance is a measure of the resistance of an insulating material to the flow of electric current. It is typically measured in megaohms (MΩ) or gigohms (GΩ). A high insulation resistance indicates that the material is a good insulator, while a low insulation resistance indicates that the material is a poor insulator. Insulation resistance is important for preventing electrical leakage and ensuring the safe operation of electrical equipment.

Row spacing in electronic components refers to the distance between adjacent rows of pins or terminals. It is a crucial parameter that determines the physical compatibility of the component with other components on a printed circuit board (PCB). Adequate row spacing ensures proper clearance between pins, preventing short circuits and ensuring reliable electrical connections. It also facilitates the insertion and removal of components during assembly and maintenance. The row spacing is typically specified in millimeters (mm) and is a standard characteristic for each component type. It is important to consider the row spacing when selecting components and designing PCBs to ensure proper fit and functionality.