424-023-502-122

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EDAC Inc. 424-023-502-122

Part Number:

424-023-502-122

Manufacturer:

EDAC Inc.

Ventron No:

1194018-424-023-502-122

Description:

CONN EDGE DUAL FMALE 23POS 0.200

ECAD Model:

Datasheet:

424-023-502-122

Payment:

Payment

Delivery:

Delivery

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Comments
  • One Stop Service

    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Specifications

EDAC Inc. 424-023-502-122 technical specifications, attributes, parameters and parts with similar specifications to EDAC Inc. 424-023-502-122.

  • Factory Lead Time
    8 Weeks
  • Contact Material

    Contact Material refers to the material used to make the electrical contacts in a component. It determines the electrical conductivity, durability, and resistance to corrosion and wear of the contacts. Common contact materials include copper, silver, gold, and alloys of these metals. The choice of contact material depends on the specific application and the required performance characteristics.

    Phosphor Bronze
  • Mount
    Through Hole
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    Metal
  • Housing Material

    Housing Material refers to the material used to construct the outer casing or enclosure of an electronic component.

    Plastic
  • Material - Insulation
    Polyphenylene Sulfide (PPS)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -65°C~125°C
  • Packaging
    Bulk
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    424
  • Published
    2005
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Termination

    Termination refers to the electrical characteristics of a component or circuit at its input or output terminals. It describes how the component or circuit interacts with external signals or devices. Termination can involve matching impedance, providing voltage or current regulation, or filtering unwanted signals. Proper termination ensures efficient signal transfer, minimizes reflections, and prevents damage to components. It is crucial for maintaining signal integrity and optimizing circuit performance.

    Solder
  • Number of Positions

    Number of Positions, in the context of electronic components, refers to the number of distinct terminals or connection points available on the component. It indicates the number of individual electrical connections that can be made to the component. A higher number of positions typically allows for more complex functionality and versatility in circuit design.

    23
  • Color
    Green
  • Number of Rows
    2
  • Gender
    Female
  • Pitch

    Pitch, in the context of electronic components, refers to the distance between the centers of adjacent pins or terminals on a component. It is typically measured in millimeters (mm) or inches (in). The pitch determines the spacing between components on a printed circuit board (PCB) and affects the overall size and layout of the board. A smaller pitch allows for more components to be placed on a given area, but it also increases the risk of shorts and other manufacturing defects.

    0.200 5.08mm
  • Contact Finish
    Gold
  • Card Type

    Card Type refers to the physical form factor of an electronic card or module. It specifies the size, shape, and pin configuration of the card, allowing it to fit into specific slots or connectors on a printed circuit board (PCB) or backplane. Common card types include PCI, PCIe, ISA, and CompactPCI, each with its own unique dimensions, pinouts, and functionality. The Card Type parameter helps ensure compatibility between the card and the system it is intended for.

    Non Specified - Dual Edge
  • Read Out
    Dual
  • Flange Feature
    Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia
  • Card Thickness
    0.093 2.36mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

424-023-502-122 Overview
A package was prepared according to Bulk's specifications.It is recommended to mount the device using type Through Hole.424 means it's a series device.Metal package is fine with it.

424-023-502-122 Features
424 series


424-023-502-122 Applications
There are a lot of EDAC Inc.
424-023-502-122 Edgeboard Connectors applications.


Audio/Video devices
Cell Phones
Digital Multimeters, PLC's (Programming Logic Controllers)
RADAR processing, digital oscilloscopes
CMOS Image sensors for mobile applications
Medical Instrumentation and medical imaging
Music recording
Digital signal processing
Scientific instruments
Rotary encoder
424-023-502-122 More Descriptions
Card Edge Metal To Metal 2 Piece Connectors Rohs Compliant: Yes |Edac 424-023-502-122
CONN EDGE DUAL FMALE 23POS 0.200
METAL TO METAL .200 X .150

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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