TE Connectivity AMP Connectors 282191-1

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Number of Positions, in the context of electronic components, refers to the number of distinct terminals or connection points available on the component. It indicates the number of individual electrical connections that can be made to the component. A higher number of positions typically allows for more complex functionality and versatility in circuit design.

Pitch, in the context of electronic components, refers to the distance between the centers of adjacent pins or terminals on a component. It is typically measured in millimeters (mm) or inches (in). The pitch determines the spacing between components on a printed circuit board (PCB) and affects the overall size and layout of the board. A smaller pitch allows for more components to be placed on a given area, but it also increases the risk of shorts and other manufacturing defects.

Orientation refers to the physical alignment or position of an electronic component in relation to a reference point or axis. It specifies the direction in which the component should be mounted or installed to ensure proper functionality and performance. Orientation is crucial for components such as diodes, transistors, capacitors, and connectors, where the polarity or pinout must be correctly aligned to prevent damage or malfunction.

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.