Weidmuller 1945430000

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Housing Material refers to the material used to construct the outer casing or enclosure of an electronic component.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Voltage - Rated refers to the maximum voltage that an electronic component can withstand without being damaged. It is typically specified in volts (V) and is an important parameter to consider when selecting components for a circuit. Exceeding the rated voltage can lead to component failure, so it is important to ensure that the voltage applied to a component does not exceed its rated voltage.

Pitch, in the context of electronic components, refers to the distance between the centers of adjacent pins or terminals on a component. It is typically measured in millimeters (mm) or inches (in). The pitch determines the spacing between components on a printed circuit board (PCB) and affects the overall size and layout of the board. A smaller pitch allows for more components to be placed on a given area, but it also increases the risk of shorts and other manufacturing defects.

Wire Gauge or Range - AWG (American Wire Gauge) is a standardized system for measuring the diameter of electrical wire. It is used to determine the current-carrying capacity and resistance of a wire. The higher the AWG number, the smaller the wire diameter and the lower the current-carrying capacity. AWG is commonly used in electrical wiring, electronics, and telecommunications.

Current - Ul is an electronic component parameter that specifies the maximum leakage current that can flow through the component when it is reverse-biased. It is typically measured in microamperes (µA) or nanoamperes (nA). A low Current - Ul value indicates that the component has a high resistance to leakage current, which is desirable in many applications.