MediaTek released the Dimensity 9000+ flagship 5G mobile platform today (22), using TSMC's 4nm process and Armv9 architecture. It is expected that smartphones equipped with the Dimensity 9000+ will be unveiled in the third quarter of this year.
It is reported that the Dimensity 9000+ is equipped with an octa-core CPU including one Arm Cortex-X2 super core with a main frequency of up to 3.2GHz, three Arm Cortex-A710 large cores and four Arm Cortex-A510 energy efficiency cores. The advanced CPU architecture of the Dimensity 9000+ and the Arm Mali-G710 flagship ten-core GPU have improved the CPU performance by 5% compared to the previous generation, and the GPU performance has improved by more than 10%.
Dimensity 9000+ supports LPDDR5X storage, built-in 8MB CPU third-level cache and 6MB system cache. In addition, Dimensity 9000+ integrates MediaTek's fifth-generation AI processor APU 5.0, which can provide energy-efficient AI computing power for different application scenarios.
Li Yanji, Deputy General Manager of MediaTek's Wireless Communication Division, said that the Dimensity 9000+ will help customers build flagship phones with strong performance and advanced mobile technology. Dimensity 9000+ has top-level AI, gaming, multimedia, video and network connection functions, which will bring users experience upgrades such as games and seamless video streaming.