Chinese PCB manufacturers expand 5G application capacity
28 August 2023
According to industry sources, driven by the growing demand for 5G mobile phone applications, Chinese PCB manufacturers are actively expanding the production capacity of HDI and substrate-like PCB (SLP) products and IC substrates.
Sources said that Chinese mobile phone manufacturers have been keen to upgrade their 5G and other high-end mobile phone motherboards by adopting a larger area of ??any layer of HDI boards to meet their increasingly complex communication technology requirements.
In addition, as RF front-end modules for 5G mobile phones become thinner and thinner, SLP boards will also be used more and more for such modules.
Therefore, HDI and SLP technologies will coexist in 5G mobile phone applications, prompting China's major PCB manufacturer Shennan Circuits, Wus Printed Circuits and Dongshan Precision Manufacturing (DSBJ) to expand production capacity to better seize the opportunity because the Chinese government Sources may launch that the policy aims to encourage consumers to buy 5G phones during a corona virus outbreak.
Shennan Cicuits plans to complete the second-phase development of its Nantong production base in Jiangsu Province by the end of March, which will increase annual production capacity of 580,000 square meters of PCB boards, and its IC substrate factory in Wuxi, Jiangsu will also be completed. Enter trial production.
Wus now has three production bases in Kunshan, Shanghai and Huangshi, one of each. Its Kunshan factory has an annual production capacity of 2.2 million square meters, and PCBs with more than 16 layers account for more than 50% of the total output, and are mainly used for telecommunications equipment applications. The company's factory in Huangshi was severely hit by the epidemic, and it is expected that after the epidemic eases, its annual production capacity will increase to a maximum of 1.5 million square meters of multilayer boards and HDI boards.
Sources said that Chinese mobile phone manufacturers have been keen to upgrade their 5G and other high-end mobile phone motherboards by adopting a larger area of ??any layer of HDI boards to meet their increasingly complex communication technology requirements.
In addition, as RF front-end modules for 5G mobile phones become thinner and thinner, SLP boards will also be used more and more for such modules.
Therefore, HDI and SLP technologies will coexist in 5G mobile phone applications, prompting China's major PCB manufacturer Shennan Circuits, Wus Printed Circuits and Dongshan Precision Manufacturing (DSBJ) to expand production capacity to better seize the opportunity because the Chinese government Sources may launch that the policy aims to encourage consumers to buy 5G phones during a corona virus outbreak.
Shennan Cicuits plans to complete the second-phase development of its Nantong production base in Jiangsu Province by the end of March, which will increase annual production capacity of 580,000 square meters of PCB boards, and its IC substrate factory in Wuxi, Jiangsu will also be completed. Enter trial production.
Wus now has three production bases in Kunshan, Shanghai and Huangshi, one of each. Its Kunshan factory has an annual production capacity of 2.2 million square meters, and PCBs with more than 16 layers account for more than 50% of the total output, and are mainly used for telecommunications equipment applications. The company's factory in Huangshi was severely hit by the epidemic, and it is expected that after the epidemic eases, its annual production capacity will increase to a maximum of 1.5 million square meters of multilayer boards and HDI boards.
