United Chemi-Con E36D101HPN392MC48M

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Termination refers to the electrical characteristics of a component or circuit at its input or output terminals. It describes how the component or circuit interacts with external signals or devices. Termination can involve matching impedance, providing voltage or current regulation, or filtering unwanted signals. Proper termination ensures efficient signal transfer, minimizes reflections, and prevents damage to components. It is crucial for maintaining signal integrity and optimizing circuit performance.

Voltage - Rated refers to the maximum voltage that an electronic component can withstand without being damaged. It is typically specified in volts (V) and is an important parameter to consider when selecting components for a circuit. Exceeding the rated voltage can lead to component failure, so it is important to ensure that the voltage applied to a component does not exceed its rated voltage.

Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.

Polarization in electronic components refers to the orientation of the electric field within the component. It is a measure of the component's ability to store electrical energy. A polarized component has a positive and a negative terminal, and the electric field is oriented from the positive to the negative terminal. When a polarized component is connected to a voltage source, the electric field is established and the component stores electrical energy.