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Image Teilenummer Hersteller Beschreibung Aussicht
18157 Image 18157 Vicor Corporation STANDOFF KIT THREADED 1=6PCS Anfrage
HAH10L TDK-Lambda Americas Inc. HEATSINK Anfrage
APA502-60-001 Artesyn Embedded Technologies PAD THERMAL SIZE60 FOR AMPSS MOD Anfrage
30190 Image 30190 Vicor Corporation HEAT SINK MICRO 0.9" THRD/LONG Anfrage
38146 Image 38146 Vicor Corporation AC FRONT END HEATSINK Anfrage
HAMF10T Image HAMF10T TDK-Lambda Americas Inc. HEATSINK PFE1000F Anfrage
LGA-HTSK-KIT-045 Artesyn Embedded Technologies LGA ACC KIT Anfrage
20264 Image 20264 Vicor Corporation THERMMATE MINI 1=10PCS Anfrage
PT4498N Texas Instruments BOOSTER(PT4484) 20A 48VIN VRT Anfrage
HALF12T Image HALF12T TDK-Lambda Americas Inc. HEATSINK PFE500F WIDTH 1.38" FIN Anfrage
16494 Image 16494 Vicor Corporation THERMOPAD MINI Anfrage
QPO-2LZ-01 Image QPO-2LZ-01 Vicor Corporation 0.3-5.5V 20A OUT RIP ATTENUATOR Anfrage
32785 Image 32785 Vicor Corporation HALF 6.3MM TALL LONGIT FLOW PINS Anfrage
APA503-00-007 Artesyn Embedded Technologies STUD MTG TAPPED FOR HEATSINK LP Anfrage
URAM2CN3 Vicor Corporation URAM OUTPUT ATTENUATION MODULE Anfrage
APA501-80-007 Artesyn Embedded Technologies HEATSINK (80)115.6X89X12MM LOPRO Anfrage
32440 Vicor Corporation 11MM LONGITUDINAL FLOW HEAT SINK Anfrage
30199 Image 30199 Vicor Corporation MODULE SHIELD MAXI SLOTTED Anfrage
18381 Image 18381 Vicor Corporation INMATE MICRO IN LL BOB Anfrage
21539 Image 21539 Vicor Corporation INMATE MAXI/MINI IN XL BOB Anfrage
PT4498C Texas Instruments BOOSTER(PT4484) 20A 48VIN HZ SMD Anfrage
3780000200 Artesyn Embedded Technologies PAD THERMAL 1/2 BRICK Anfrage
VIZ0012 Image VIZ0012 Vicor Corporation MECHNCL SAMPLE VTM HALF CHIP SMD Anfrage
43807-04 Image 43807-04 Vicor Corporation HEAT SINK FOR DCDC CNVTR/ARRAYS Anfrage
HAA041 TDK-Lambda Americas Inc. HEATSINK PH50S PH75S 0.5" FINS Anfrage
VI-RAM-I2 Vicor Corporation RIPPLE ATTENUATOR MODULE 20A Anfrage
30249 Image 30249 Vicor Corporation HOLDUP CAPACITOR 450V/470UF Anfrage
03780200600 Artesyn Embedded Technologies PAD THERMAL 1/4 BRICK Anfrage
VI-ANN-CQ Image VI-ANN-CQ Vicor Corporation VI-IAM INPUT ATTENUATOR MODULE Anfrage
HS-23-C Murata Power Solutions Inc. HEATSINK C11 Anfrage
43809-05 Image 43809-05 Vicor Corporation HEAT SINK FOR DCDC CNVTR/ARRAYS Anfrage
ARA00539 Image ARA00539 TDK-Lambda Americas Inc. INPUT INDUCTOR FOR PFE1000 Anfrage
CM2A1 Bel Power Solutions CHASSIS MOUNTING KIT FOR DC-DC Anfrage
UF224S18 Image UF224S18 CUI Inc. KIT CONVERTER DC-DC 18V SGL OUT Anfrage
VI-A66-CQ Image VI-A66-CQ Vicor Corporation VI-IAM INPUT ATTENUATOR MODULE Anfrage
APA504-00-001 Artesyn Embedded Technologies SOCKET SPRING(20-CONTROL/15-PWR) Anfrage
30090 Image 30090 Vicor Corporation HEATSINK VI-200 TRANSVERSE 0.9" Anfrage
18393 Image 18393 Vicor Corporation INMATE MICRO OUT LL BOB Anfrage
PT7745C Texas Instruments REGULATR 20A BSTR FOR PT7711 SMD Anfrage
22101 Vicor Corporation SURFMATE OUTPUT SOCKET Anfrage
URAM3M23 Vicor Corporation URAM OUTPUT ATTENUATION MODULE Anfrage
VI-RAM-M1 Vicor Corporation VI-RAM RIPPLE ATTENUATOR MODULE Anfrage
QPI-4LZ Image QPI-4LZ Vicor Corporation FILTER ACTIVE EMI 48V 7A LGA Anfrage
16493 Image 16493 Vicor Corporation THERMOPAD MAXI Anfrage
32183-01 Vicor Corporation HEX STANDOFF 0.525" Anfrage
43807-08 Image 43807-08 Vicor Corporation HEAT SINK FOR DCDC CNVTR/ARRAYS Anfrage
20265 Image 20265 Vicor Corporation THERMAL PAD FOR MICRORAM 1=10PCS Anfrage
APA501-60-003 Image APA501-60-003 Artesyn Embedded Technologies HEATSINK (60)57.5X59X22.5MM VERT Anfrage
32173 Image 32173 Vicor Corporation HEATSINK MICRO 0.4" THRD/TRANS Anfrage
18388 Vicor Corporation INMATE SOCKET FOR MAXI MODULE Anfrage
Aufzeichnungen 292
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